IRGC4660B
RoHS 
RoHS compliant
RoHS compliantPackage Die
Category Discrete Semiconductor Products / Transistors - IGBTs - Single
Description
IGBT CHIP WAFER
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Technical Details
Supply Chain
Factory Lead Time 15 Weeks
Physical
Mounting Type Surface Mount
Package / Case Die
Technical
Operating Temperature -55°C~175°C TJ
Packaging Bulk
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Input Type Standard
Reverse Recovery Time 45ns
Voltage - Collector Emitter Breakdown (Max) 600V
Current - Collector (Ic) (Max) 48A
IGBT Type Trench Field Stop
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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