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Package Die
Category Discrete Semiconductor Products / Transistors - IGBTs - Single
Description IGBT CHIP WAFER
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Inventory: 1869
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount
Package / Case Die

Technical

Operating Temperature -40°C~175°C TJ
Packaging Bulk
Published 2015
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Subcategory Insulated Gate BIP Transistors
Input Type Standard
Polarity/Channel Type N-CHANNEL
Voltage - Collector Emitter Breakdown (Max) 600V
Test Condition 400V, 120A, 4.7 Ω, 15V
Vce(on) (Max) @ Vge, Ic 2.05V @ 15V, 120A
Collector Current-Max (IC) 120A
IGBT Type Trench
Gate Charge 240nC
Td (on/off) @ 25°C 50ns/160ns
Gate-Emitter Voltage-Max 20V
Gate-Emitter Thr Voltage-Max 6.5V

Compliance

RoHS Status ROHS3 Compliant

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