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Package Die
Category Discrete Semiconductor Products / Transistors - IGBTs - Single
Description IGBT CHIP WAFER
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Inventory: 8558
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Technical Details

Supply Chain

Factory Lead Time 15 Weeks

Physical

Mounting Type Surface Mount
Package / Case Die
Surface Mount YES
Transistor Element Material SILICON

Technical

Operating Temperature 175°C TJ
Packaging Bulk
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Position UPPER
Terminal Form NO LEAD
JESD-30 Code R-XUUC-N2
Number of Elements 1
Configuration SINGLE
Input Type Standard
Transistor Application MOTOR CONTROL
Polarity/Channel Type N-CHANNEL
Voltage - Collector Emitter Breakdown (Max) 600V
Current - Collector (Ic) (Max) 4A
IGBT Type Trench
Gate-Emitter Thr Voltage-Max 6.5V

Compliance

RoHS Status ROHS3 Compliant

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