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RoHS
RoHS RoHS compliant
Package 4-XFBGA, FCBGA
Category Integrated Circuits (ICs) / Specialized ICs
Description Silicon Serial Number 4-Pin Flip-Chip
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Technical Details

Compliance

RoHS Status ROHS3 Compliant
Radiation Hardening No

Dimensions

Width 0.69mm
Length 1.09mm
Height Seated (Max) 0.59mm

Technical

Memory Density 64 bit
Standby Current-Max 0.000001A
Memory Width 1
Organization 64X1
Supply Current-Max 0.0001mA
Supply Voltage-Min (Vsup) 1.5V
Temperature Grade INDUSTRIAL
Power Supplies 2/5V
Supply Voltage-Max (Vsup) 5.25V
JESD-30 Code R-PBGA-B4
Pin Count 4
Base Part Number DS2411
Time@Peak Reflow Temperature-Max (s) 20
Number of Functions 1
Peak Reflow Temperature (Cel) 240
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Other Memory ICs
HTS Code 8542.39.00.01
Applications PCB, Network Node, Equipment Identification/Registration
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Type Silicon Serial Number
ECCN Code EAR99
Number of Terminations 4
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Part Status Obsolete
Pbfree Code no
Published 2003
Packaging Tape & Reel (TR)

Physical

Surface Mount YES
Package / Case 4-XFBGA, FCBGA
Mounting Type Surface Mount

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