IDT72V51543L7-5BBI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Specialized ICs
Description
FIFO Mem Sync Dual Depth Uni-Dir 2K x 18 x 32 256-Pin BGA
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Technical Details
Physical
Mount Surface Mount
Package / Case BGA
Number of Pins 256
Technical
Published 2005
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature ALTERNATIVE MEMORY WIDTH:9-BIT
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 256
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 100mA
Access Time 4 ns
Direction Unidirectional
Organization 64KX18
Memory Width 18
Density 1 Mb
Standby Current-Max 0.01A
Parallel/Serial PARALLEL
Sync/Async Synchronous
Word Size 18b
Memory IC Type OTHER FIFO
Alternate Memory Width 9
Output Enable YES
Cycle Time 7.5 ns
Dimensions
Height Seated (Max) 3.5mm
Length 17mm
Width 17mm
Compliance
RoHS Status Non-RoHS Compliant
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