1817240
RoHS
/
Package /
Category Soldering, Desoldering, Rework Products / Solder
Description
Henkel 500g Jar Lead Free Solder Paste
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Inventory: 9425
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status Non-RoHS Compliant
Technical
Melting Point 423°F 217°C
Process Lead Free
Form Jar, 17.64 oz (500g)
Storage/Refrigeration Temperature 32°F~50°F 0°C~10°C
Shelf Life 6 Months
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type Solder Paste
Moisture Sensitivity Level (MSL) Not Applicable
Part Status Active
Published 2000
Packaging Bar
Supply Chain
Factory Lead Time 8 Weeks
Alternative Model
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