1354298
RoHS
/
Package /
Category Soldering, Desoldering, Rework Products / Solder
Description
63S4 WS200 ACP 500G JAR
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Technical Details
Supply Chain
Factory Lead Time 2 Weeks
Technical
Published 2000
Series WS200?
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Type Solder Paste
Composition Sn63Pb37 (63/37)
Shelf Life 6 Months
Storage/Refrigeration Temperature 32°F~50°F 0°C~10°C
Shelf Life Start Date of Manufacture
Form Jar, 17.64 oz (500g)
Process Leaded
Melting Point 361°F 183°C
Flux Type Water Soluble
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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