70-0102-0510
RoHS
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Package /
Category Soldering, Desoldering, Rework Products / Solder
Description
SOLDERPASTE NO CLEAN 63/37 500GM
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Technical Details
Supply Chain
Factory Lead Time 5 Weeks
Physical
Weight 1.1lbs 499g
Technical
Packaging Jar
Published 2004
Series Profile?, 256
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Solder Paste
Composition Sn63Pb37 (63/37)
Shelf Life 6 Months
Storage/Refrigeration Temperature 32°F~50°F 0°C~10°C
Shelf Life Start Date of Manufacture
Form Jar, 17.64 oz (500g)
Process Leaded
Melting Point 361°F 183°C
Flux Type No-Clean
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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