5-2013620-2
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
Non-RoHS Compliant Open Frame Gold Solder PGA, ZIF (ZIP) Socket UL94V-0 15.0muin 0.38mum
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Technical Details
Physical
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 989 (35 x 36)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Technical
Packaging Bulk
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type PGA, ZIF (ZIP)
Number of Positions 989
Contact Finish - Mating Gold
Pitch - Mating 0.039 1.00mm
Contact Finish - Post Tin-Lead
Housing Color Black
ELV Compliant
Pitch - Post 0.039 1.00mm
Dimensions
Contact Finish Thickness - Mating 15.0μin 0.38μm
Contact Finish Thickness - Post 15.0μin 0.38μm
Compliance
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
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