2-640362-2
RoHS
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Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 28POS GOLD
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Technical Details
Physical
Contact Material Copper
Mount Vertical
Mounting Type Through Hole
Insulation Material Thermoplastic
Housing Material Thermoplastic, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Technical
Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series Diplomate DL
JESD-609 Code e4
Feature Closed Frame
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 28
Color Black
Number of Rows 2
Gender Female
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Depth 17.63mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 28
PCB Contact Pattern RECTANGULAR
Body Breadth 0.694 inch
Lead Length 3.25mm
Contact Style BELLOWED TYPE
Contact Resistance 30mOhm
Insulation Resistance 10GOhm
Row Spacing 15.49 mm
Mating Contact Pitch 0.1 inch
ELV Compliant
Dielectric Withstanding Voltage 1000VAC V
Termination Post Length 0.128 3.24mm
Pitch - Post 0.100 2.54mm
Dimensions
Length 35.43mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Compliance
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
Alternative Model
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