2-5916783-2
RoHS 
RoHS compliant
RoHS compliantPackage /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
IC & Component Sockets LPSLZ PGA370 30AU
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Technical Details
Supply Chain
Factory Lead Time 14 Weeks
Physical
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Insulation Material Polymer
Housing Material Liquid Crystal Polymer (LCP)
Number of Positions or Pins (Grid) 370 (19 x 19)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Technical
Packaging Tray
Published 2009
JESD-609 Code e3
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Socket
Type PGA, ZIF (ZIP)
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Gender Female
Additional Feature LOW PROFILE
HTS Code 8536.69.40.40
Contact Finish - Mating Gold
Orientation Straight
Depth 51.77mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 370
Housing Color Natural
Contact Resistance 20mOhm
Insulation Resistance 5GOhm
Row Spacing 1.27 mm
ELV Compliant
Termination Post Length 0.093 2.36mm
Pitch - Post 0.100 2.54mm
Dimensions
Length 64.47mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Compliance
Material Flammability Rating UL94 V-0
Radiation Hardening No
REACH SVHC Unknown
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Alternative Model
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