1825046-9
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
IC & Component Sockets 828-AG12SM-LF=SMT800 DIP, TIN/TIN
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Technical Details
Supply Chain
Factory Lead Time 3 Weeks
Physical
Contact Material Copper
Contact Plating Tin
Mount Vertical
Mounting Type Surface Mount
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Technical
Packaging Tube
Published 2006
Series 800
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 28
Number of Rows 2
Contact Finish - Mating Tin
Pitch 2.54mm
Orientation Straight
Pitch - Mating 0.100 2.54mm
Number of Contacts 28
Contact Style Screw
Contact Resistance 10mOhm
Insulation Resistance 5GOhm
Row Spacing 15.24 mm
ELV Compliant
Pitch - Post 0.100 2.54mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Alternative Model
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