28-6574-10
RoHS 
RoHS compliant
RoHS compliantPackage /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET ZIF 28POS TIN
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Technical Details
Supply Chain
Factory Lead Time 5 Weeks
Physical
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Technical
Packaging Bulk
Published 2008
Series 57
JESD-609 Code e3
Feature Closed Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type DIP
Type DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Number of Positions 28
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Tin
Current Rating (Amps) 1A
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 28
PCB Contact Pattern RECTANGULAR
Operating Temperature (Max) 105°C
Body Breadth 0.9 inch
Body Depth 0.47 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Row Spacing 15.24 mm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Dimensions
Height 11.9mm
Length 50.5mm
Width 22.9mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Compliance
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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