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32-655000-10-P

Aries Electronics
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors - Adapters
Description IC & Component Sockets TSOP TO DIP ADAPT 655000 SERIES
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Inventory: 3829
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Technical Details

Supply Chain

Factory Lead Time 5 Weeks

Physical

Mount Through Hole
Mounting Type Through Hole
Number of Pins 32
Contact Material - Mating Copper
Contact Material - Post Brass
Board Material FR4 Epoxy Glass

Technical

Published 2006
Series Correct-A-Chip? 655000
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Contact Finish - Mating Silver
Pitch - Mating 0.020 0.50mm
Contact Finish - Post Tin-Lead
Lead Length 3.175mm
Device Socket Type IC SOCKET
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) TSOP
Convert To (Adapter End) DIP, 0.6 (15.24mm) Row Spacing

Dimensions

Contact Finish Thickness - Post 200.0μin 5.08μm

Compliance

RoHS Status Non-RoHS Compliant

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