22-304504-18
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors - Adapters
Description
IC & Component Sockets SOIC TO DIP
PDF
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Inventory: 941
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Technical Details
Supply Chain
Factory Lead Time 5 Weeks
Physical
Mount Through Hole
Mounting Type Through Hole
Number of Pins 22
Contact Material - Post Brass
Board Material FR4 Epoxy Glass
Technical
Published 2009
Series Correct-A-Chip? 304504
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Additional Feature SOCKET ADAPTER
Pitch - Mating 0.050 1.27mm
Number of Contacts 22
Contact Finish - Post Tin-Lead
Lead Length 3.175mm
Device Socket Type IC SOCKET
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) SOIC
Convert To (Adapter End) DIP, 0.4 (10.16mm) Row Spacing
Dimensions
Contact Finish Thickness - Post 200.0μin 5.08μm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Lead Free
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