1111841-8
RoHS
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Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors - Adapters
Description
IC & Component Sockets MSOP TO DIP ADAPTER
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Inventory: 1703
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Contact Finish Thickness - Post 200.0μin 5.08μm
Technical
Convert To (Adapter End) DIP, 0.3 (7.62mm) Row Spacing
Convert From (Adapter End) MSOP
Pitch - Post 0.100 2.54mm
Termination Post Length 0.125 3.18mm
Device Socket Type IC SOCKET
Lead Length 3.175mm
Contact Finish - Post Tin-Lead
Number of Contacts 8
Pitch - Mating 0.020 0.50mm
Additional Feature UL 94V-0
Number of Rows 2
Min Operating Temperature -55°C
Max Operating Temperature 105°C
ECCN Code EAR99
Termination Solder
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Part Status Active
JESD-609 Code e0
Series Correct-A-Chip? 1111841
Published 2006
Physical
Board Material FR4 Epoxy Glass
Contact Material - Post Brass
Number of Pins 8
Mounting Type Through Hole
Mount Through Hole
Contact Plating Tin
Supply Chain
Factory Lead Time 6 Weeks
Alternative Model
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