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2013883-2

TE Connectivity
RoHS
/
Package LGA
Category Connectors, Interconnects / Sockets for ICs, Transistors - Accessories
Description BACK PLATE ASSY, LGA115X
PDF
/
Inventory: 1522
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Package / Case LGA
Insulation Material Polycarbonate

Technical

Packaging Bulk
Published 2005
Part Status Active
Max Operating Temperature 100°C
Min Operating Temperature -25°C
Orientation Straight
Depth 72.5mm
ELV Compliant
Plating Nickel

Dimensions

Length 48.2mm

Compliance

Radiation Hardening No
REACH SVHC Unknown
RoHS Status RoHS Compliant

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