100-018-051
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
100 RoHS Compliant 2008 Closed Frame Seal Tape DIP, 0.3 (7.62mm) Row Spacing Socket -65C~125C 1A 8.00muin 0.203mum
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Technical Details
Physical
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Number of Pins 18
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Technical
Operating Temperature -65°C~125°C
Packaging Bulk
Published 2008
Series 100
Feature Closed Frame, Seal Tape
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Gold
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Dimensions
Contact Finish Thickness - Mating 8.00μin 0.203μm
Contact Finish Thickness - Post Flash
Compliance
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
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