100-008-050
RoHS
/
Package /
Category Connectors, Interconnects / Sockets for ICs, Transistors
Description
IC & Component Sockets 8P SM SK .1SP X .3
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Inventory: 2917
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Technical Details
Physical
Contact Material Copper
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Number of Pins 8
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Technical
Operating Temperature -65°C~125°C
Packaging Bulk
Published 2007
Series 100
Feature Open Frame
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch 2.54mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 1kV
Lead Pitch 2.54mm
Contact Finish - Post Gold
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Dimensions
Contact Finish Thickness - Mating 8.00μin 0.203μm
Contact Finish Thickness - Post Flash
Compliance
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
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