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XCCACEM32-BG388I

Xilinx Inc.
RoHS
/
Package 388-BBGA
Category Memory Cards, Modules / Memory - Modules
Description Contains Lead BOTTOM Obsolete INDUSTRIAL memory module 32MB 1.83.3V 35mm 0.24mA
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Inventory: 1980
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Radiation Hardening No

Dimensions

Width 35mm
Length 35mm
Height Seated (Max) 2.87mm

Technical

Data Retention Time-Min 20
Endurance 1000000 Write/Erase Cycles
Parallel/Serial SERIAL
Memory Density 33554432 bit
Memory Width 16
Organization 2MX16
Supply Current-Max 0.24mA
Memory Type FLASH
Memory Size 32MB
Supply Voltage-Min (Vsup) 1.71V
Temperature Grade INDUSTRIAL
Power Supplies 1.83.3V
Supply Voltage-Max (Vsup) 1.89V
Pin Count 388
Frequency 133MHz
Terminal Pitch 1.27mm
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.32.00.71
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish TIN LEAD
Number of Terminations 388
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Published 1999

Physical

Number of Pins 388
Surface Mount YES
Package / Case 388-BBGA

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