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XCCACEM16-BG388I

Xilinx Inc.
RoHS
/
Package 388-BBGA
Category Memory Cards, Modules / Memory - Modules
Description Contains Lead BOTTOM Obsolete INDUSTRIAL memory module 16MB 1.83.3V 35mm 0.24mA
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Inventory: 7473
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Technical Details

Physical

Package / Case 388-BBGA
Surface Mount YES
Number of Pins 388

Technical

Published 1999
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Frequency 133MHz
Pin Count 388
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.83.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.71V
Memory Size 16MB
Memory Type FLASH
Supply Current-Max 0.24mA
Organization 1MX16
Memory Width 16
Memory Density 16777216 bit
Parallel/Serial SERIAL
Endurance 1000000 Write/Erase Cycles
Data Retention Time-Min 20

Dimensions

Height Seated (Max) 2.87mm
Length 35mm
Width 35mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

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