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MT9VDDT6472HG-335F2

Micron Technology Inc.
RoHS
/
Package 200-SODIMM
Category Memory Cards, Modules / Memory - Modules
Description MODULE DDR SDRAM 512MB 200SODIMM
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Inventory: 2097
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Radiation Hardening No

Dimensions

Height 31.8mm

Technical

Access Mode SINGLE BANK PAGE BURST
I/O Type COMMON
Access Time (Max) 0.7 ns
Max Frequency 333MHz
Memory Density 4831838208 bit
Standby Current-Max 0.045A
Memory Width 72
Output Characteristics 3-STATE
Organization 64MX72
Data Bus Width 72b
Supply Current-Max 3.645mA
Clock Frequency 166MHz
Memory Type DDR SDRAM
Speed 333MT/s
Number of Ports 1
Memory Size 512MB
Min Supply Voltage 2.3V
Max Supply Voltage 2.7V
Temperature Grade COMMERCIAL
Number of Elements 9
Operating Supply Voltage 2.5V
Pin Count 200
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.6mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 235
Terminal Position DUAL
Technology CMOS
Subcategory Other Memory ICs
HTS Code 8542.32.00.36
Additional Feature AUTO/SELF REFRESH
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish TIN LEAD
Number of Terminations 200
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Part Status Obsolete
JESD-609 Code e0
Published 2002
Packaging Bulk

Physical

Number of Pins 200
Package / Case 200-SODIMM
Mount Socket

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