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MT29F2G08ABBEAH4:E TR

Micron Technology Inc.
RoHS
RoHS RoHS compliant
Package 63-VFBGA
Category Integrated Circuits (ICs) / Memory
Description Obsolete 2013 BOTTOM Non-Volatile ic memory 0C~70C TA 1.7V 2147483648bit 9mm
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 9mm
Length 11mm
Height Seated (Max) 1mm

Technical

Programming Voltage 1.8V
Memory Density 2147483648 bit
Memory Width 8
Organization 256MX8
Memory Interface Parallel
Memory Format FLASH
Operating Mode ASYNCHRONOUS
Memory Type Non-Volatile
Memory Size 2Gb 256M x 8
Supply Voltage-Min (Vsup) 1.7V
Supply Voltage-Max (Vsup) 1.95V
JESD-30 Code R-PBGA-B63
Base Part Number MT29F2G08
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.8mm
Supply Voltage 1.8V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Position BOTTOM
Voltage - Supply 1.7V~1.95V
Technology FLASH - NAND
HTS Code 8542.32.00.51
Terminal Finish TIN SILVER COPPER
ECCN Code 3A991.B.1.A
Number of Terminations 63
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e1
Published 2013
Packaging Tape & Reel (TR)
Operating Temperature 0°C~70°C TA

Physical

Surface Mount YES
Package / Case 63-VFBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 3 Weeks

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