IDT71V416VL15BEGI8
RoHS
/
Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2005 Parallel BOTTOM (Memory Format) Memory 85C 3V 4194304bit 9mm
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Technical Details
Compliance
RoHS Status RoHS Compliant
Dimensions
Width 9mm
Length 9mm
Height Seated (Max) 1.2mm
Technical
Access Time (Max) 15 ns
Memory Density 4194304 bit
Memory Width 16
Organization 256KX16
Memory Type RAM, SRAM - Asynchronous
Interface Parallel
Supply Voltage-Min (Vsup) 3V
Temperature Grade INDUSTRIAL
Supply Voltage-Max (Vsup) 3.6V
Qualification Status Not Qualified
JESD-30 Code S-PBGA-B48
Pin Count 48
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.75mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.32.00.41
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish TIN SILVER COPPER
ECCN Code 3A991.B.2.A
Number of Terminations 48
Moisture Sensitivity Level (MSL) 4
JESD-609 Code e1
Published 2005
Packaging Tape & Reel (TR)
Physical
Surface Mount YES
Package / Case TFBGA
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