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RoHS
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Package TFBGA
Category Integrated Circuits (ICs) / Memory
Description Asynchronous BALL 3-STATE 2005 (Memory Format) Memory 85C 3.6V 4Mb 160mA
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Technical Details

Physical

Mount Surface Mount
Package / Case TFBGA
Number of Pins 48

Technical

Published 2005
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 48
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.75mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 48
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Number of Ports 1
Nominal Supply Current 160mA
Memory Type RAM, SRAM - Asynchronous
Access Time 15 ns
Output Characteristics 3-STATE
Memory Width 16
Address Bus Width 18b
Density 4 Mb
I/O Type COMMON
Sync/Async Asynchronous
Word Size 16b
Standby Voltage-Min 3V

Dimensions

Length 9mm

Compliance

RoHS Status RoHS Compliant

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