IDT71V25761SA183BGI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 3-STATE 2009 Parallel (Memory Format) Memory 85C 3.135V 4718592bit 0.035A
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Width 14mm
Length 22mm
Height Seated (Max) 2.36mm
Technical
Standby Voltage-Min 3.14V
I/O Type COMMON
Access Time (Max) 3.3 ns
Memory Density 4718592 bit
Standby Current-Max 0.035A
Memory Width 36
Output Characteristics 3-STATE
Organization 128KX36
Supply Current-Max 0.35mA
Operating Mode SYNCHRONOUS
Memory Type RAM, SRAM
Interface Parallel
Supply Voltage-Min (Vsup) 3.135V
Temperature Grade INDUSTRIAL
Power Supplies 2.53.3V
Supply Voltage-Max (Vsup) 3.465V
Qualification Status Not Qualified
Pin Count 119
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 183MHz
Reach Compliance Code not_compliant
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
HTS Code 8542.32.00.41
Additional Feature PIPELINED ARCHITECTURE
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A991.B.2.A
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Published 2009
Physical
Surface Mount YES
Package / Case BGA
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