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RoHS
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Category Integrated Circuits (ICs) / Memory
Description J BEND 3-STATE 2009 Parallel (Memory Format) Memory 85C 3V 262144bit 0.002A
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 7.5184mm
Length 17.9324mm
Height Seated (Max) 3.556mm

Technical

Standby Voltage-Min 3V
I/O Type COMMON
Access Time (Max) 10 ns
Memory Density 262144 bit
Standby Current-Max 0.002A
Memory Width 8
Output Characteristics 3-STATE
Organization 32KX8
Supply Current-Max 0.1mA
Memory Type RAM, SRAM - Asynchronous
Interface Parallel
Supply Voltage-Min (Vsup) 3V
Temperature Grade INDUSTRIAL
Power Supplies 3.3V
Supply Voltage-Max (Vsup) 3.6V
Qualification Status Not Qualified
Pin Count 28
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code unknown
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form J BEND
Terminal Position DUAL
Technology CMOS
Subcategory SRAMs
HTS Code 8542.32.00.41
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Matte Tin (Sn) - annealed
ECCN Code EAR99
Number of Terminations 28
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e3
Published 2009
Packaging Tape & Reel (TR)

Physical

Number of Pins 28
Surface Mount YES

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