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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description BALL 3-STATE 2008 Parallel (Memory Format) Memory 70C 3.135V 4718592bit 0.04A
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 14mm
Length 22mm
Height Seated (Max) 2.36mm

Technical

Standby Voltage-Min 3.14V
I/O Type COMMON
Access Time (Max) 4.2 ns
Memory Density 4718592 bit
Standby Current-Max 0.04A
Memory Width 18
Output Characteristics 3-STATE
Organization 256KX18
Supply Current-Max 0.3mA
Operating Mode SYNCHRONOUS
Memory Type RAM, SRAM
Interface Parallel
Supply Voltage-Min (Vsup) 3.135V
Temperature Grade COMMERCIAL
Power Supplies 2.53.3V
Supply Voltage-Max (Vsup) 3.465V
Qualification Status Not Qualified
Pin Count 119
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 133MHz
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
HTS Code 8542.32.00.41
Additional Feature PIPELINED ARCHITECTURE
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A991.B.2.A
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Published 2008

Physical

Surface Mount YES
Package / Case BGA

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