IDT71T75902S80BGGI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2005 Parallel BOTTOM (Memory Format) Memory 85C 2.375V 18874368bit 14mm
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Technical
Published 2005
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
ECCN Code 3A991.B.2.A
Terminal Finish TIN LEAD
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECTURE
HTS Code 8542.32.00.41
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Interface Parallel
Memory Type RAM, SRAM
Operating Mode SYNCHRONOUS
Organization 1MX18
Memory Width 18
Memory Density 18874368 bit
Access Time (Max) 8 ns
Dimensions
Height Seated (Max) 2.36mm
Length 22mm
Width 14mm
Compliance
RoHS Status RoHS Compliant
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