IDT71T75902S80BGG8
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2005 Parallel BOTTOM (Memory Format) Memory 70C 2.375V 18874368bit 14mm
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Technical Details
Compliance
RoHS Status RoHS Compliant
Dimensions
Width 14mm
Length 22mm
Height Seated (Max) 2.36mm
Technical
Access Time (Max) 8 ns
Memory Density 18874368 bit
Memory Width 18
Organization 1MX18
Operating Mode SYNCHRONOUS
Memory Type RAM, SRAM
Interface Parallel
Supply Voltage-Min (Vsup) 2.375V
Temperature Grade COMMERCIAL
Supply Voltage-Max (Vsup) 2.625V
Qualification Status Not Qualified
Pin Count 119
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1.27mm
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.32.00.41
Additional Feature FLOW-THROUGH ARCHITECTURE
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish TIN SILVER COPPER
ECCN Code 3A991.B.2.A
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e1
Published 2005
Packaging Tape & Reel (TR)
Physical
Surface Mount YES
Package / Case BGA
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