IDT71T75902S75BGGI
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2005 Parallel BOTTOM (Memory Format) Memory 85C 2.375V 18874368bit 14mm
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Technical
Published 2005
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
ECCN Code 3A991.B.2.A
Terminal Finish TIN LEAD
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECTURE
HTS Code 8542.32.00.41
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Interface Parallel
Memory Type RAM, SRAM
Operating Mode SYNCHRONOUS
Organization 1MX18
Memory Width 18
Memory Density 18874368 bit
Access Time (Max) 7.5 ns
Dimensions
Height Seated (Max) 2.36mm
Length 22mm
Width 14mm
Compliance
RoHS Status RoHS Compliant
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