IDT70V7319S133DDI
RoHS
/
Package TQFP
Category Integrated Circuits (ICs) / Memory
Description
GULL WING 3-STATE 2008 Parallel (Memory Format) Memory 85C 3.15V 4718592bit 0.04A
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Technical Details
Physical
Package / Case TQFP
Surface Mount YES
Technical
Published 2008
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 4
Number of Terminations 144
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 144
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.45V
Power Supplies 2.5/3.33.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3.15V
Interface Parallel
Number of Ports 2
Memory Type RAM, SRAM
Operating Mode SYNCHRONOUS
Supply Current-Max 0.675mA
Organization 256KX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.04A
Memory Density 4718592 bit
Access Time (Max) 15 ns
I/O Type COMMON
Standby Voltage-Min 3.15V
Dimensions
Height Seated (Max) 1.6mm
Length 20mm
Width 20mm
Compliance
RoHS Status Non-RoHS Compliant
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