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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Active BALL 3-STATE 2009 (Memory Format) Memory 70C 3.3V 9Mb 0.05A
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Inventory: 4950
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Technical Details

Technical

Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade COMMERCIAL
Interface Parallel
Number of Ports 1
Memory Type RAM, SRAM
Supply Current-Max 0.26mA
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Published 2009
Packaging Tape & Reel
I/O Type COMMON
Access Time (Max) 4.2 ns
Standby Current-Max 0.05A
Density 9 Mb
Address Bus Width 19b
Output Characteristics 3-STATE

Physical

Number of Pins 119
Surface Mount YES
Package / Case BGA

Supply Chain

Factory Lead Time 7 Weeks

Compliance

Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Thickness 2.15mm
Width 22mm
Length 14mm
Height Seated (Max) 2.36mm

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