71V67703S75BQGI8
RoHS
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Package /
Category Integrated Circuits (ICs) / Memory
Description
Active BALL 2009 Parallel (Memory Format) Memory 85C 3.3V 9Mb 13mm
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Surface Mount YES
Number of Pins 165
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 165
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECTURE
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 165
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade INDUSTRIAL
Interface Parallel
Number of Ports 1
Memory Type RAM, SRAM
Organization 256KX36
Address Bus Width 18b
Density 9 Mb
Access Time (Max) 7.5 ns
Dimensions
Length 15mm
Width 13mm
Thickness 1.2mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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