71V67703S75BQG8
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Package /
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 2009 (Memory Format) Memory 70C 3.465V 9Mb 265mA
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Mount Surface Mount
Number of Pins 165
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 165
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH ARCHITECTURE
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 117MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 165
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Number of Ports 1
Nominal Supply Current 265mA
Memory Type RAM, SRAM
Access Time 7.5 ns
Organization 256KX36
Address Bus Width 18b
Density 9 Mb
Sync/Async Synchronous
Word Size 36b
Dimensions
Length 15mm
Width 13mm
Thickness 1.2mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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