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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Synchronous Active BALL 3-STATE (Memory Format) Memory 85C 3.465V 9Mb 285mA
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Mount Surface Mount
Package / Case BGA
Number of Pins 119

Technical

Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 117MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Number of Ports 1
Nominal Supply Current 285mA
Memory Type RAM, SRAM
Access Time 7.5 ns
Organization 256KX36
Output Characteristics 3-STATE
Address Bus Width 18b
Density 9 Mb
Standby Current-Max 0.07A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b

Dimensions

Height Seated (Max) 2.36mm
Length 14mm
Width 22mm
Thickness 2.15mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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