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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Active BALL 2005 Parallel (Memory Format) Memory 85C 3.3V 9Mb 22mm
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Inventory: 5950
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 119

Technical

Packaging Bulk
Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade INDUSTRIAL
Interface Parallel
Number of Ports 1
Memory Type RAM, SRAM
Address Bus Width 19b
Density 9 Mb
Access Time (Max) 8.5 ns

Dimensions

Length 14mm
Width 22mm
Thickness 2.15mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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