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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Active BALL 3-STATE 2005 (Memory Format) Memory 85C 3.3V 9Mb 0.06A
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Thickness 2.15mm
Width 22mm
Length 14mm
Height Seated (Max) 2.36mm

Technical

I/O Type COMMON
Access Time (Max) 8 ns
Standby Current-Max 0.06A
Density 9 Mb
Address Bus Width 19b
Output Characteristics 3-STATE
Supply Current-Max 0.06mA
Clock Frequency 95MHz
Memory Type RAM, SRAM
Number of Ports 1
Interface Parallel
Temperature Grade INDUSTRIAL
Supply Voltage-Max (Vsup) 3.465V
Operating Supply Voltage 3.3V
Pin Count 119
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Additional Feature FLOW-THROUGH ARCHITECTURE
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code no
JESD-609 Code e1
Published 2005
Packaging Tape & Reel

Physical

Number of Pins 119
Surface Mount YES
Package / Case BGA

Supply Chain

Factory Lead Time 7 Weeks

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