71V3577S85BQG8
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Memory
Description
Active BALL 3-STATE 2005 (Memory Format) Memory 70C 3.3V 4.5Mb 0.03A
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Inventory: 6925
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Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case FBGA
Surface Mount YES
Number of Pins 165
Technical
Packaging Tape & Reel
Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 165
Terminal Finish TIN SILVER COPPER
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW THROUGH ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Pin Count 165
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade COMMERCIAL
Interface Parallel
Number of Ports 1
Memory Type RAM, SRAM
Clock Frequency 87MHz
Output Characteristics 3-STATE
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.03A
Access Time (Max) 8.5 ns
I/O Type COMMON
Dimensions
Length 15mm
Width 13mm
Thickness 1.2mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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