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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Synchronous Active BALL 3-STATE (Memory Format) Memory 70C 3.3V 4.5Mb 200mA
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Inventory: 6751
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Mount Surface Mount
Package / Case BGA
Number of Pins 119

Technical

Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Memory Size 512kB
Number of Ports 1
Nominal Supply Current 200mA
Memory Type RAM, SDR, SRAM
Max Supply Current 200mA
Frequency (Max) 100MHz
Access Time 8 ns
Output Characteristics 3-STATE
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.03A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b

Dimensions

Height 2.15mm
Length 14mm
Width 22mm
Thickness 2.15mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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