71V3577S75BGI8
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 2009 (Memory Format) Memory 85C 3.465V 4.5Mb 22mm
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECTURE
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Frequency 117MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 119
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Number of Ports 1
Memory Type RAM, SRAM
Access Time 7.5 ns
Address Bus Width 17b
Density 4.5 Mb
Word Size 36b
Sync/Async Synchronous
Compliance
Lead Free Contains Lead
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 2.15mm
Width 22mm
Length 14mm
Height Seated (Max) 2.36mm
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