71V35761SA166BQGI
RoHS
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Package FBGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 3-STATE (Memory Format) Memory 85C 3.465V 4.5Mb 330mA
PDF
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Buying Options
Total Price: USD $12.08
Unit Price: USD $12.0824
≥1 USD $12.0824
≥10 USD $11.18128
≥100 USD $11.029568
≥500 USD $10.89088
≥1000 USD $9.544313
≥3000 USD $9.135078
Inventory: 159
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Mount Surface Mount
Package / Case FBGA
Number of Pins 165
Technical
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 165
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 165
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Memory Size 512kB
Number of Ports 1
Nominal Supply Current 330mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 166MHz
Access Time 3.5 ns
Output Characteristics 3-STATE
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.035A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Dimensions
Length 15mm
Width 13mm
Thickness 1.2mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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