71V2556SA133BGG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 3-STATE 2015 Parallel (Memory Format) Memory 70C 3.3V 4.5Mb 0.04A
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Number of Pins 119
Technical
Packaging Bulk
Published 2015
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade COMMERCIAL
Interface Parallel
Number of Ports 1
Memory Type RAM, SRAM
Supply Current-Max 0.3mA
Output Characteristics 3-STATE
Memory Width 36
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.04A
Access Time (Max) 4.2 ns
I/O Type COMMON
Dimensions
Height Seated (Max) 2.36mm
Length 22mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
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