71T75602S150BG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 3-STATE (Memory Format) Memory 70C 2.625V 18Mb 215mA
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Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Technical
Published 2012
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 119
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Frequency 150MHz
Pin Count 119
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Memory Size 2.3MB
Number of Ports 1
Nominal Supply Current 215mA
Memory Type RAM, SDR, SRAM
Max Supply Current 215mA
Frequency (Max) 150MHz
Access Time 3.8 ns
Output Characteristics 3-STATE
Address Bus Width 19b
Density 18 Mb
Standby Current-Max 0.04A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Standby Voltage-Min 2.38V
Dimensions
Height 2.15mm
Length 14mm
Width 22mm
Thickness 2.15mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
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