71T75602S133BGGI8
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active BALL 3-STATE (Memory Format) Memory 85C 2.625V 18Mb 215mA
PDF
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Buying Options
Total Price: USD $34.11
Unit Price: USD $34.106516
≥1 USD $34.106516
≥200 USD $13.198584
≥500 USD $12.73513
≥1000 USD $12.506685
Inventory: 1127
Minimum: 1
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 2.15mm
Width 22mm
Length 14mm
Height Seated (Max) 2.36mm
Technical
Standby Voltage-Min 2.38V
Word Size 36b
Sync/Async Synchronous
I/O Type COMMON
Standby Current-Max 0.06A
Density 18 Mb
Address Bus Width 19b
Output Characteristics 3-STATE
Access Time 4.2 ns
Frequency (Max) 133MHz
Memory Type RAM, SDR, SRAM
Nominal Supply Current 215mA
Number of Ports 1
Memory Size 2.3MB
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Interface Parallel
Temperature Grade INDUSTRIAL
Operating Supply Voltage 2.5V
Pin Count 119
Time@Peak Reflow Temperature-Max (s) 30
Frequency 133MHz
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Additional Feature PIPELINED ARCHITECTURE
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Published 2012
Physical
Number of Pins 119
Package / Case BGA
Mount Surface Mount
Supply Chain
Factory Lead Time 8 Weeks
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