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RoHS
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Package BGA
Category Integrated Circuits (ICs) / Memory
Description Synchronous Active BALL 3-STATE (Memory Format) Memory 85C 2.625V 18Mb 195mA
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Thickness 2.15mm
Width 22mm
Length 14mm
Height 2.15mm

Technical

Standby Voltage-Min 2.38V
Word Size 36b
Sync/Async Synchronous
I/O Type COMMON
Standby Current-Max 0.06A
Density 18 Mb
Address Bus Width 19b
Output Characteristics 3-STATE
Access Time 5 ns
Frequency (Max) 100MHz
Max Supply Current 195mA
Memory Type RAM, SDR, SRAM
Nominal Supply Current 195mA
Number of Ports 1
Memory Size 2.3MB
Min Supply Voltage 2.375V
Max Supply Voltage 2.625V
Interface Parallel
Temperature Grade INDUSTRIAL
Operating Supply Voltage 2.5V
Pin Count 119
Frequency 100MHz
Supply Voltage 2.5V
Number of Functions 1
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory SRAMs
Additional Feature PIPELINED ARCHITECTURE
Min Operating Temperature -40°C
Max Operating Temperature 85°C
Terminal Finish Tin/Lead (Sn63Pb37)
Number of Terminations 119
Moisture Sensitivity Level (MSL) 3
Part Status Active
Pbfree Code no
JESD-609 Code e0
Published 2012

Physical

Number of Pins 119
Package / Case BGA
Mount Surface Mount

Supply Chain

Factory Lead Time 8 Weeks

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