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RoHS
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Package TQFP
Category Integrated Circuits (ICs) / Memory
Description Active GULL WING 3-STATE 2008 (Memory Format) Memory 70C 3.6V 512kb 0.003A
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Technical Details

Supply Chain

Factory Lead Time 7 Weeks

Physical

Package / Case TQFP
Surface Mount YES
Number of Pins 128

Technical

Packaging Bulk
Published 2008
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 128
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 128
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 64kB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Clock Frequency 83MHz
Access Time 7 ns
Output Characteristics 3-STATE
Address Bus Width 30b
Density 512 kb
Standby Current-Max 0.003A
I/O Type COMMON
Standby Voltage-Min 3V

Dimensions

Height Seated (Max) 1.6mm
Length 20mm
Width 14mm
Thickness 1.4mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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