70V9089L9PF8
RoHS
/
Package TQFP
Category Integrated Circuits (ICs) / Memory
Description
Synchronous Active GULL WING 3-STATE (Memory Format) Memory 70C 3.6V 512kb 225mA
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Mount Surface Mount
Package / Case TQFP
Number of Pins 100
Technical
Packaging Tape & Reel
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 100
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Frequency 40MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 100
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Number of Ports 2
Nominal Supply Current 225mA
Memory Type RAM, SRAM
Access Time 20 ns
Organization 64KX8
Output Characteristics 3-STATE
Address Bus Width 16b
Density 512 kb
Standby Current-Max 0.003A
I/O Type COMMON
Sync/Async Synchronous
Word Size 8b
Standby Voltage-Min 3V
Dimensions
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
Thickness 1.4mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
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