70V7519S200BCG8
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2013 Parallel BOTTOM (Memory Format) Memory 70C 3.45V 9Mb 17mm
PDF
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Buying Options
Total Price: USD $407.05
Unit Price: USD $407.051516
≥1 USD $407.051516
≥200 USD $162.416233
≥500 USD $156.990018
≥1000 USD $154.307763
Inventory: 1222
Minimum: 1
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Technical Details
Compliance
RoHS Status RoHS Compliant
Radiation Hardening No
Dimensions
Thickness 1.4mm
Width 17mm
Length 17mm
Technical
Density 9 Mb
Address Bus Width 36b
Access Time 15 ns
Frequency (Max) 200MHz
Memory Type RAM, SDR, SRAM
Number of Ports 2
Memory Size 1.1MB
Min Supply Voltage 3.15V
Max Supply Voltage 3.45V
Interface Parallel
Temperature Grade COMMERCIAL
Operating Supply Voltage 3.3V
Lead Pitch 1mm
Pin Count 256
Frequency 200MHz
Supply Voltage 3.3V
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Additional Feature PIPELINED OR FLOW THROUGH ARCHITECTURE
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3
Pbfree Code yes
JESD-609 Code e1
Published 2013
Packaging Tape & Reel
Physical
Number of Pins 256
Surface Mount YES
Package / Case BGA
Supply Chain
Factory Lead Time 7 Weeks
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