70V7519S200BCG
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Memory
Description
BALL 2013 Parallel BOTTOM (Memory Format) Memory 70C 3.45V 9Mb 17mm
PDF
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Buying Options
Total Price: USD $185.32
Unit Price: USD $185.318461
≥1 USD $185.318461
≥200 USD $71.71585
≥500 USD $69.195082
≥1000 USD $67.950452
Inventory: 1218
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 7 Weeks
Physical
Package / Case BGA
Surface Mount YES
Number of Pins 256
Technical
Packaging Bulk
Published 2013
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED OR FLOW THROUGH ARCHITECTURE
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 200MHz
Pin Count 256
Lead Pitch 1mm
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Memory Size 1.1MB
Number of Ports 2
Memory Type RAM, SDR, SRAM
Frequency (Max) 200MHz
Access Time 15 ns
Address Bus Width 36b
Density 9 Mb
Dimensions
Length 17mm
Width 17mm
Thickness 1.4mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
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